Even since the 1956 Darmouth College workshop hosted by AI pioneers including John McCarthy, Marvin Minsky, Herbert Simon, Allen Newell etc., AI has gone through 2 waves of industry adoption. Domestic companies also benefit from tax holidays, free land, preferential loans and procurement incentives. VP of Manufacturing & GM of East Fishkill 300mm-Fab, ON Semiconductor. Technical and Marketing Director / 技术市场中心总监 Huatian / 华天科技. Steven has a rich experience and demonstrated leadership in customer support. Mr. Yc Lee was born in Penang, Malaysia. Mr. Graf is mainly responsible for marketing and investor relations and organises the public presentation of 0eC. He is the author of several reports covering various packaging platforms, equipment, and materials. How is the supply chain adapting to consolidation of leading edge process technology? According to the Semiconductor Manufacturing International Corporation’s latest annual report, SMIC – the largest semiconductor chip manufacturer in mainland China – has significantly increased a senior Taiwanese executive’s salary and granted him property worth 22.5 million yuan (US$3.4 million). CISES is subject to the UK Data Protection Act 1998 and is registered in the UK with the Information Commissioner t o process your personal information. to subscribe to the hard copies. Dr. Siva Sivaram is President, Technologyand Strategy,at Western Digital where he is responsible for the development of the corporate strategy and the technologies that fuel the company’s growth. The research interests of Dr. WEI are VLSI design methodology, communication specific IC development, mobile computing and reconfigurable computing. Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the CEO of Xiamen Sky Semiconductor Co., Ltd. How sustainable has the recovery been for semiconductor suppliers this year in spite of COVID? Lilly is responsible for the relationships and client engagements for some of Deloitte’s largest global clients and works cross-border in China, Japan, Brazil, India, and EU countries. The technological gap between China’s and Taiwan’s foundries is stark. Links to other websites are provided for the user’s convenience. GaN Power ICs use lateral enhancement mode (eMode) HEMT technology to overcome the traditional gate driving complexity. FCBGA packaging is widely used in emerging market segments such as 5G, AI, data centers, computing, automotive infotainment and autonomous driving. Prior to joining Renesas, Maoka led Post Merger Integration at Lenovo which acquired NECs personal computer business through Joint Venture structure. Lilly has led numerous strategic initiatives for Deloitte and is recognized for her commitment to nurturing and promoting women leadership and inclusion in technology companies. As technology nodes scale down and density of memory goes up, it presents key challenges to provide effective packaging and test solutions. MSD has four businesses: Material Science (MS), Life Science (LS), Spectroscopy (SPEC) and Semiconductor (Semi). In this context, heterogeneous integration takes place on wafer level and on board/substrate level as well. Senior Director of NAND Process Development Intel Dalian / 英特尔. Ms. Orlando joined Nanotronics as employee number three, where she is currently Chief Product Officer. He also holds an M.B.A. from Shanghai Jiao Tong University. He was selected as Shanghai Model Worker and to the National Ten Thousand Talent Program in 2016. He has published more than 40 papers in peer-reviewed journals and has obtained 2 patents. Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. Phil began his career in automotive electronics as a design engineer at GM on their ABS systems. I am the first author of several publications and more than 10 patents in the field of wafer level packaging, micro systems technologies and 3D integration. He was responsible for New Business Development, Company Globalization Strategies and Involved in potential merger and acquisition. This agreement constitutes the entire agreement between CISES and you. He has also initiated 12” wafer level bumping project in Korea transferring the technology to Singapore working with EDB, Chartered (now Global Foundry) and also UTAC to set up the joint venture as 1st 12” bumping company in Singapore. Lead future technology development with new services and business models beyond the current scope of divisions and BU’s, Define and implement innovation strategy including method and tools, Build up and lead new Chongqing R&D hub as general manager, Lead technical marketing activities to promote our technologies to key stakeholders, Lead business development activities to seek new technology and business fields, in which the company can generate meaningful business cases and future growth, Rutgers University, Beijing International Program; EMBA, Beta Gamma Sigma, 2001, Rice University, Houston, Texas; M.S. E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. He is a senior member of IEEE. Moved to MRC (Sputter and Etch). Especially, advantages of higher production efficiency, more advanced process, better supply chain, and cost-efficient in CMOS compatible manufacturing are achievable in 8 inch GaN on Si. He was responsible for sales, service, and marketing during these years. We’re committed to advancing future semiconductor manufacturing by driving innovation, business and investment opportunities. In this episode of China Money Podcast, listen to all the news headlines in the China venture investment and tech sector for the week ending April 9. Michael Ehinger is the vice president and has been with TRUMPF Hüttinger for 15 years. He has been in the semiconductor area for 21 years with specialty of technology & business development in the advanced packaging area such as Fan Out WLP, Wafer level CSP, Flip chip bumping, SiP (System In Packaging) as well as Panel Level Packaging He has started his work in LG / Hynix for reliability, material & process development of packaging in late of 1990s after he got Ph.D degree of material science engineering in Korea. He holds more than 60 published patents and (co)-authored over 100 publications in scientific journals/proceedings. Dr. Breidenbach is focused on leveraging outsourcing opportunities with leading silicon foundries and outsourced semiconductor manufacturing and test (OSAT) companies across logic and power technologies. In the future, companies will place human-machine collaboration as their core strategy and will embrace these technology tools and methodologies for business improvement by enabling better understanding and interactions between humans and machines. Ben joined Thermo Fisher Scientific in 2003 and served in a variety of management roles through his 17 years career in the company, including Air Quality Instrument (AQI) China Business Development Specialist, Environmental Instrument Division (EID) China Business Development Manager, Radiation Monitoring and Security Instrument China Commercial Manager, AQI China Commercial Manager, EID China Commercial Director, EPM APAC Sr. Commercial Director, EPM VP/GM, and most recently VP/GM for both CAD and MSD China commercial, . 5G、数据中心和人工智能等这些重要的应用市场正在推动对系统内存和存储的巨大需求。随着晶圆制造技术节点的进化和存储密度的增加,封装和测试解决方案也面临着关键挑战。在这次介绍中,我们将就一些关键问题进行讨论并提供建议,希望给解决不断发展的存储器封装和测试市场的需求提供帮助意见。, Senior Director Production Partner Procurement, Infineon. ZeroEC technology replaces the current electric conductors with a patented technology that enables the use of free electrons for data transport in semiconductor applications. November 23, 2020. More Moore roadmap for high-performance computing enablement – IRDS view. These three economies benefited from US capital and technology transfers, being Asian allies during the Cold War. Tim Olson is founder, CEO and a director of Deca Technologies, Inc. Tim has served in both CEO and CTO roles as Deca has established its industry leading M-Series™ fan-out and Adaptive Patterning™ technologies. He was the founder, President & CEO and Chairman of the Board of Datang Microelectronics Technology Co., Ltd. from 1996 to 2005. Original comments adding insight and contributing to analysis are especially encouraged. Prior to his work with 0eC, he was working in the telecommunication and automotive branch as a system engineer and a freelance IT consultant for more than 10 years, and he has worked in projects for process analysis and customisable system administration. Beside the hardware, TRUMPF is also offering engineering expertise for modelling and layout of thermal heating applications used e.g. He currently holds 2 patents. He was the Vice President, Special Assistant to Chairman in China Resources Microelectronics Limited in 2015. Siva has more the 25 years’ experience in the global semiconductor industry. Prior to joining Infineon, Dr. Breidenbach was a senior consultant in the Strategy and Transformation Division at IBM, where he consulted clients in automotive, electronics and the process industry on supply management optimization. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years. But don’t assume it’s impossible. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, accelerated computing architectures, cellular baseband modems, WLAN, WiMAX, cellular broadband, digital consumer, foundry, EMS, intelligent systems, and overall semiconductors. Previously he has held a variety of positions in Product Test Engineering, Regional Sales and Business Development. Dr. Mustafa Badaroglu is Principal Engineer and Architect at Qualcomm responsible from technology and architecture definition and development for products employing Compute-In-Memory Technology. Here, he was mainly involved in the development of wafer level packaging processes, the development of flip chip multi-chip modules, RF modules and high density pixel detector modules. Tim was previously Sr. VP of Global Research & Development and Emerging Technologies at Amkor as well as EVP of Products and Operations at Micro Component Technology. Prior to assuming his current role, CL served as VP of Amkor Technology China. Prior to this role, Dr. Yao serves as a senior member of technical staff and metal CVD core team leader in Applied Materials Inc., Santa Clara, California, USA. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. He has incubated, invested and mentored various technology startups in China, Singapore and USA and has more than 30 years of experience in the technology and strategy advisory services in Asia, US and Europe where he has advised many Fortune 500 companies on enterprise digital transformation across multiple generations of technology evolution. This has major impact on the required equipment capabilities in the fields of accuracy, die size handling, cleanliness, productivity and flexibility. Sivaram received his Doctorate and Master’s degrees in Materials Science from the Rensselaer Polytechnic Institute and has been nominated to its Board of Trustees. He holds over 3 US patent in the field of advanced packaging. System integration, performance, cost and enhanced product functionality form the major driving force behind contemporary innovations in packaging. Prior to leading ATTD, Sabi led the Corporate Quality Network within Intel’s Technology Manufacturing Group from 2002 to 2009. China’s education needs to nurture talent and innovation in basic science to fill the technological gap in semiconductor fabrication technology. Dr. Li was awarded the 1st Class Reward of National Technology Improvements, First Prize of Shanghai Science and Technology Progress Award, and Outstanding Scientific Achievement Reward. He holds over 100 US patents in the field of semiconductor packaging. Facing the huge gap between demand and local supply, what measures China will take and what measures should be taken to develop the domestic semiconductor industry will not only be concerned the Chinese people, but also affect other countries in the world, especially in the current complex international environment. Ruurd Boomsma received a Master Degree with focus on Semiconductor Physics and High Vacuum Technology, from the State University of Groningen, the Netherlands. 在政府支持、巨大市场体量以及研发投入增加等众多因素的推动下,中国大陆、日本、韩国和中国台湾成为亚太地区四大半导体市场。, 亚太四大半导体市场正于全球加速崛起,而5G、人工智能、大数据将成为推动市场需求的主要因素。随着半导体行业在后疫情时代逐渐形成“多极市场”,增强供应链韧性将会是成功的关键。, President & Country Manager / 董事&中国区总裁 Amkor Technology China / 安靠封装测试(上海)有限公司. He was most recently senior vice president of Quality for Western Digital Corporation, who oversaw the quality assurance and customer technical support functions worldwide for all of its brands. Advances in semiconductor manufacturing demands skills and expertise which cannot be developed overnight. The trade war is a reminder for Chinese leadership that it can no longer rely on imports and must develop in-house core technology and pursue technological leapfrogging, especially in essential components such as semiconductors. In particular, he has advised on a number of the most notable recent transactions across the semiconductor, electronics and industrial tech subsectors. Sabi joined Intel in 1984. Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). ... Apr 11 2021 … She also served on the nominating committee for Deloitte’s Board of Directors. Traditional topologies using silicon FETs have reached their limits and GaN Power ICs enable more advanced, soft-switching topologies to operate at 20x higher frequency with increased efficiency and very high power density. From May 2019, he has been the Chairman of Zing Semiconductor. He received the bachelor and master’s degree in engineeringfrom the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. And also different type of applications require different types of multi-chip memory package with multiple functions. Through his experience in these projects, Mr. Graf has become an advisor for an investment fund, where he mainly consults in tech investment cases. Dean Sha has served as the Head of Business for China at AtoS, , Europe’s largest consulting firm, He was also global head of the renowned company CDI, a top 3 strategy consulting firms in Japan. CSTIC 2021, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Additionally, he was the founder and CEO of Twin Creeks Technologies, a solar panel and equipment company. China International Semiconductor Executive Summit offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry. China was the world’s biggest chip buyer last year, but it’s still just a bit producer. Herbert worked in the Semiconductor industry for 25+ years, focused on wet processing . We also collect certain personal data from other group companies to whom you have given information through their websites. China International Semiconductor Executive SummitOctober 12-13, 2021, For Equipment | Materials | EDA | Software Suppliers, For Foundries | OSATS | IC Design Houses | End Users, © 2021 China International Semiconductor Executive Summit, Professor of Institute of Microelectronics / 教授 Tsinghua University / 清华大学微电子学研究所. Mr. Chen is Member of Chinese Institution of Certified Public Accountants (CICPA). I got my Ph.D in Physics in 1993 from the Grenoble University (FRANCE) in the field of laser materials and I joined the CEA-LETI in 1994. China supplies just 30 per cent of its chips domestically. AIII actively engage in the AI ecosystem development including Slingshot 2020 @ SFF x SWITCH, the World AI Conference (WAIC) SAIL Award, IBM Call for Code Hackathon, Shanghai AI Development Alliance (SAIA)., Singapore’s AI Professionals Association (AIP) and Singapore Lean Launchpad. Before entering the company, Michael took the position of the division manager in SICK AG and was the product manager in Draeger AG between 1990 and 1992. The requirements and time to market for these applications vary based on packaging complexity, electrical, thermal, reliability, quality and process control. E.h. Herbert Reichl. With over 20 years of relevant experience and over 13 years at Goldman Sachs, Mr. Stokes has extensive experience advising companies across the technology industry. Chief Data Scientist & Technical Expert at Group Strategy Committee and Dean of Institute of Intelligent Society, Shenlan Academy of Sciences / 首席数据科学家 集团战略委员会战略技术专家 深兰科学院智能社会研究院 院长 DeepBlue / 深兰科技. The Taiwanese government sent its first batch of engineers to the United States for training in the 1970s, who later returned to help build Taiwan’s semiconductor foundry. His main interest areas are advanced IC packaging technology including equipment & materials. China announced tax breaks Monday to spur growth of its semiconductor industry following U.S. sanctions that alarmed the ruling Communist Party by cutting off access to American processor chips for tech giant Huawei and some other companies. 蔡骅先生于2016年加入CNW,他在国际物流领域拥有20多年的经验,并获得国际运输管理硕士学位。 他对中国的进出口渠道和物流各方面都非常熟悉。 蔡骅先生为人友善并具有很强的沟通能力。, VP/GM, China – Chemical Analysis Division & Material and Structural Division / 副总裁兼总经理 中国区化学分析与材料和结构分析业务 Thermo Fisher / 赛默飞世尔科技. Author of 100+ granted/pending US patents. From 2000 until 2010 he additionally took over the position of personal assistant for the director of Fraunhofer IZM – Prof. Dr.-Ing. formally TWG of Assembly & Packaging of the International Roadmap of Semiconductors (ITRS) and now the Heterogeneous Integration Roadmap (HIR) and the Jisso International Council (JIC) where he is actively contributing to the strategy and packaging roadmap development. This presentation will discuss the trends and challenges of the FCBGA ecosystem and the three value creation roles OSAT’s play. In addition to his devotion in research activities, Steve is a promotor of technology commercialization. Semiconductor Principal Consultant, Omdia. 3 Feb 2021 - 4:12AM The key to GaN’s game-changing attack on silicon is true, monolithic integration – combining GaN FET, GaN logic and GaN analog circuits to achieve a ‘digital-in, power-out’ MHz building block. 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As China emerges as leaders in advanced logic and memory fabrication and advanced chip design, the need for tools that accelerate yield learning and deliver great ROI in terms of Time-to-Market and automation become increasingly relevant. Since 2017, Dr. Li has been the Chairman of Simgui. However, the U.S.-China trade war that began in 2018 has stymied its efforts by denying the country access to advanced component technologies. Tim holds over two dozen issued United States patents relating to packaging, software, equipment, process, and design. CMOS sensor as the advanced sensing tip, is around us and improving our daily life anywhere and anytime. He is now Besi’s Chief Technology Officer and also responsible for strategic supply chain management and overall quality. Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region. He has authored and co-authored numerous scientific papers presentations and reports in the field of microelectronic packaging and holds a number of patents.

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