Even since the 1956 Darmouth College workshop hosted by AI pioneers including John McCarthy, Marvin Minsky, Herbert Simon, Allen Newell etc., AI has gone through 2 waves of industry adoption. Domestic companies also benefit from tax holidays, free land, preferential loans and procurement incentives. VP of Manufacturing & GM of East Fishkill 300mm-Fab, ON Semiconductor. Technical and Marketing Director / 技术市场中心总监 Huatian / 华天科技. Steven has a rich experience and demonstrated leadership in customer support. Mr. Yc Lee was born in Penang, Malaysia. Mr. Graf is mainly responsible for marketing and investor relations and organises the public presentation of 0eC. He is the author of several reports covering various packaging platforms, equipment, and materials. How is the supply chain adapting to consolidation of leading edge process technology? According to the Semiconductor Manufacturing International Corporation’s latest annual report, SMIC – the largest semiconductor chip manufacturer in mainland China – has significantly increased a senior Taiwanese executive’s salary and granted him property worth 22.5 million yuan (US$3.4 million). CISES is subject to the UK Data Protection Act 1998 and is registered in the UK with the Information Commissioner t o process your personal information. to subscribe to the hard copies. Dr. Siva Sivaram is President, Technologyand Strategy,at Western Digital where he is responsible for the development of the corporate strategy and the technologies that fuel the company’s growth. The research interests of Dr. WEI are VLSI design methodology, communication specific IC development, mobile computing and reconfigurable computing. Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the CEO of Xiamen Sky Semiconductor Co., Ltd. How sustainable has the recovery been for semiconductor suppliers this year in spite of COVID? Lilly is responsible for the relationships and client engagements for some of Deloitte’s largest global clients and works cross-border in China, Japan, Brazil, India, and EU countries. The technological gap between China’s and Taiwan’s foundries is stark. Links to other websites are provided for the user’s convenience. GaN Power ICs use lateral enhancement mode (eMode) HEMT technology to overcome the traditional gate driving complexity. FCBGA packaging is widely used in emerging market segments such as 5G, AI, data centers, computing, automotive infotainment and autonomous driving. Prior to joining Renesas, Maoka led Post Merger Integration at Lenovo which acquired NECs personal computer business through Joint Venture structure. Lilly has led numerous strategic initiatives for Deloitte and is recognized for her commitment to nurturing and promoting women leadership and inclusion in technology companies. As technology nodes scale down and density of memory goes up, it presents key challenges to provide effective packaging and test solutions. MSD has four businesses: Material Science (MS), Life Science (LS), Spectroscopy (SPEC) and Semiconductor (Semi). In this context, heterogeneous integration takes place on wafer level and on board/substrate level as well. Senior Director of NAND Process Development Intel Dalian / 英特尔. Ms. Orlando joined Nanotronics as employee number three, where she is currently Chief Product Officer. He also holds an M.B.A. from Shanghai Jiao Tong University. He was selected as Shanghai Model Worker and to the National Ten Thousand Talent Program in 2016. He has published more than 40 papers in peer-reviewed journals and has obtained 2 patents. Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. Phil began his career in automotive electronics as a design engineer at GM on their ABS systems. I am the first author of several publications and more than 10 patents in the field of wafer level packaging, micro systems technologies and 3D integration. He was responsible for New Business Development, Company Globalization Strategies and Involved in potential merger and acquisition. This agreement constitutes the entire agreement between CISES and you. He has also initiated 12” wafer level bumping project in Korea transferring the technology to Singapore working with EDB, Chartered (now Global Foundry) and also UTAC to set up the joint venture as 1st 12” bumping company in Singapore. Lead future technology development with new services and business models beyond the current scope of divisions and BU’s, Define and implement innovation strategy including method and tools, Build up and lead new Chongqing R&D hub as general manager, Lead technical marketing activities to promote our technologies to key stakeholders, Lead business development activities to seek new technology and business fields, in which the company can generate meaningful business cases and future growth, Rutgers University, Beijing International Program; EMBA, Beta Gamma Sigma, 2001, Rice University, Houston, Texas; M.S. E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. He is a senior member of IEEE. Moved to MRC (Sputter and Etch). Especially, advantages of higher production efficiency, more advanced process, better supply chain, and cost-efficient in CMOS compatible manufacturing are achievable in 8 inch GaN on Si. He was responsible for sales, service, and marketing during these years. We’re committed to advancing future semiconductor manufacturing by driving innovation, business and investment opportunities. In this episode of China Money Podcast, listen to all the news headlines in the China venture investment and tech sector for the week ending April 9. Michael Ehinger is the vice president and has been with TRUMPF Hüttinger for 15 years. He has been in the semiconductor area for 21 years with specialty of technology & business development in the advanced packaging area such as Fan Out WLP, Wafer level CSP, Flip chip bumping, SiP (System In Packaging) as well as Panel Level Packaging He has started his work in LG / Hynix for reliability, material & process development of packaging in late of 1990s after he got Ph.D degree of material science engineering in Korea. He holds more than 60 published patents and (co)-authored over 100 publications in scientific journals/proceedings. Dr. Breidenbach is focused on leveraging outsourcing opportunities with leading silicon foundries and outsourced semiconductor manufacturing and test (OSAT) companies across logic and power technologies. In the future, companies will place human-machine collaboration as their core strategy and will embrace these technology tools and methodologies for business improvement by enabling better understanding and interactions between humans and machines. Ben joined Thermo Fisher Scientific in 2003 and served in a variety of management roles through his 17 years career in the company, including Air Quality Instrument (AQI) China Business Development Specialist, Environmental Instrument Division (EID) China Business Development Manager, Radiation Monitoring and Security Instrument China Commercial Manager, AQI China Commercial Manager, EID China Commercial Director, EPM APAC Sr. Commercial Director, EPM VP/GM, and most recently VP/GM for both CAD and MSD China commercial, . 5G、数据中心和人工智能等这些重要的应用市场正在推动对系统内存和存储的巨大需求。随着晶圆制造技术节点的进化和存储密度的增加，封装和测试解决方案也面临着关键挑战。在这次介绍中，我们将就一些关键问题进行讨论并提供建议，希望给解决不断发展的存储器封装和测试市场的需求提供帮助意见。, Senior Director Production Partner Procurement, Infineon. ZeroEC technology replaces the current electric conductors with a patented technology that enables the use of free electrons for data transport in semiconductor applications. November 23, 2020. More Moore roadmap for high-performance computing enablement – IRDS view. These three economies benefited from US capital and technology transfers, being Asian allies during the Cold War. Tim Olson is founder, CEO and a director of Deca Technologies, Inc. Tim has served in both CEO and CTO roles as Deca has established its industry leading M-Series™ fan-out and Adaptive Patterning™ technologies. He was the founder, President & CEO and Chairman of the Board of Datang Microelectronics Technology Co., Ltd. from 1996 to 2005. Original comments adding insight and contributing to analysis are especially encouraged. Prior to his work with 0eC, he was working in the telecommunication and automotive branch as a system engineer and a freelance IT consultant for more than 10 years, and he has worked in projects for process analysis and customisable system administration. Beside the hardware, TRUMPF is also offering engineering expertise for modelling and layout of thermal heating applications used e.g. He currently holds 2 patents. He was the Vice President, Special Assistant to Chairman in China Resources Microelectronics Limited in 2015. Siva has more the 25 years’ experience in the global semiconductor industry. Prior to joining Infineon, Dr. Breidenbach was a senior consultant in the Strategy and Transformation Division at IBM, where he consulted clients in automotive, electronics and the process industry on supply management optimization. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years. But don’t assume it’s impossible. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, accelerated computing architectures, cellular baseband modems, WLAN, WiMAX, cellular broadband, digital consumer, foundry, EMS, intelligent systems, and overall semiconductors. Previously he has held a variety of positions in Product Test Engineering, Regional Sales and Business Development. Dr. Mustafa Badaroglu is Principal Engineer and Architect at Qualcomm responsible from technology and architecture definition and development for products employing Compute-In-Memory Technology. Here, he was mainly involved in the development of wafer level packaging processes, the development of flip chip multi-chip modules, RF modules and high density pixel detector modules. Tim was previously Sr. VP of Global Research & Development and Emerging Technologies at Amkor as well as EVP of Products and Operations at Micro Component Technology. Prior to assuming his current role, CL served as VP of Amkor Technology China. Prior to this role, Dr. Yao serves as a senior member of technical staff and metal CVD core team leader in Applied Materials Inc., Santa Clara, California, USA. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry’s first pre-competitive research consortium. He has incubated, invested and mentored various technology startups in China, Singapore and USA and has more than 30 years of experience in the technology and strategy advisory services in Asia, US and Europe where he has advised many Fortune 500 companies on enterprise digital transformation across multiple generations of technology evolution. This has major impact on the required equipment capabilities in the fields of accuracy, die size handling, cleanliness, productivity and flexibility. Sivaram received his Doctorate and Master’s degrees in Materials Science from the Rensselaer Polytechnic Institute and has been nominated to its Board of Trustees. He holds over 3 US patent in the field of advanced packaging. System integration, performance, cost and enhanced product functionality form the major driving force behind contemporary innovations in packaging. Prior to leading ATTD, Sabi led the Corporate Quality Network within Intel’s Technology Manufacturing Group from 2002 to 2009. China’s education needs to nurture talent and innovation in basic science to fill the technological gap in semiconductor fabrication technology. Dr. Li was awarded the 1st Class Reward of National Technology Improvements, First Prize of Shanghai Science and Technology Progress Award, and Outstanding Scientific Achievement Reward. He holds over 100 US patents in the field of semiconductor packaging. Facing the huge gap between demand and local supply, what measures China will take and what measures should be taken to develop the domestic semiconductor industry will not only be concerned the Chinese people, but also affect other countries in the world, especially in the current complex international environment. Ruurd Boomsma received a Master Degree with focus on Semiconductor Physics and High Vacuum Technology, from the State University of Groningen, the Netherlands. 在政府支持、巨大市场体量以及研发投入增加等众多因素的推动下，中国大陆、日本、韩国和中国台湾成为亚太地区四大半导体市场。, 亚太四大半导体市场正于全球加速崛起，而5G、人工智能、大数据将成为推动市场需求的主要因素。随着半导体行业在后疫情时代逐渐形成“多极市场”，增强供应链韧性将会是成功的关键。, President & Country Manager / 董事&中国区总裁 Amkor Technology China / 安靠封装测试（上海）有限公司. He was most recently senior vice president of Quality for Western Digital Corporation, who oversaw the quality assurance and customer technical support functions worldwide for all of its brands. Advances in semiconductor manufacturing demands skills and expertise which cannot be developed overnight. The trade war is a reminder for Chinese leadership that it can no longer rely on imports and must develop in-house core technology and pursue technological leapfrogging, especially in essential components such as semiconductors. In particular, he has advised on a number of the most notable recent transactions across the semiconductor, electronics and industrial tech subsectors. Sabi joined Intel in 1984. Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). ... Apr 11 2021 … She also served on the nominating committee for Deloitte’s Board of Directors. Traditional topologies using silicon FETs have reached their limits and GaN Power ICs enable more advanced, soft-switching topologies to operate at 20x higher frequency with increased efficiency and very high power density. From May 2019, he has been the Chairman of Zing Semiconductor. He received the bachelor and master’s degree in engineeringfrom the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. And also different type of applications require different types of multi-chip memory package with multiple functions. Through his experience in these projects, Mr. Graf has become an advisor for an investment fund, where he mainly consults in tech investment cases. Dean Sha has served as the Head of Business for China at AtoS, , Europe’s largest consulting firm, He was also global head of the renowned company CDI, a top 3 strategy consulting firms in Japan. CSTIC 2021, one of the largest and the most comprehensive annual semiconductor technology conferences in China and Asia since 2000. Additionally, he was the founder and CEO of Twin Creeks Technologies, a solar panel and equipment company. China International Semiconductor Executive Summit offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry. China was the world’s biggest chip buyer last year, but it’s still just a bit producer. Herbert worked in the Semiconductor industry for 25+ years, focused on wet processing . We also collect certain personal data from other group companies to whom you have given information through their websites. China International Semiconductor Executive SummitOctober 12-13, 2021, For Equipment | Materials | EDA | Software Suppliers, For Foundries | OSATS | IC Design Houses | End Users, © 2021 China International Semiconductor Executive Summit, Professor of Institute of Microelectronics / 教授 Tsinghua University / 清华大学微电子学研究所. Mr. Chen is Member of Chinese Institution of Certified Public Accountants (CICPA). I got my Ph.D in Physics in 1993 from the Grenoble University (FRANCE) in the field of laser materials and I joined the CEA-LETI in 1994. China supplies just 30 per cent of its chips domestically. AIII actively engage in the AI ecosystem development including Slingshot 2020 @ SFF x SWITCH, the World AI Conference (WAIC) SAIL Award, IBM Call for Code Hackathon, Shanghai AI Development Alliance (SAIA)., Singapore’s AI Professionals Association (AIP) and Singapore Lean Launchpad. Before entering the company, Michael took the position of the division manager in SICK AG and was the product manager in Draeger AG between 1990 and 1992. The requirements and time to market for these applications vary based on packaging complexity, electrical, thermal, reliability, quality and process control. E.h. Herbert Reichl. With over 20 years of relevant experience and over 13 years at Goldman Sachs, Mr. Stokes has extensive experience advising companies across the technology industry. Chief Data Scientist & Technical Expert at Group Strategy Committee and Dean of Institute of Intelligent Society, Shenlan Academy of Sciences / 首席数据科学家 集团战略委员会战略技术专家 深兰科学院智能社会研究院 院长 DeepBlue / 深兰科技. The Taiwanese government sent its first batch of engineers to the United States for training in the 1970s, who later returned to help build Taiwan’s semiconductor foundry. His main interest areas are advanced IC packaging technology including equipment & materials. China announced tax breaks Monday to spur growth of its semiconductor industry following U.S. sanctions that alarmed the ruling Communist Party by cutting off access to American processor chips for tech giant Huawei and some other companies. 蔡骅先生于2016年加入CNW，他在国际物流领域拥有20多年的经验，并获得国际运输管理硕士学位。 他对中国的进出口渠道和物流各方面都非常熟悉。 蔡骅先生为人友善并具有很强的沟通能力。, VP/GM, China – Chemical Analysis Division & Material and Structural Division / 副总裁兼总经理 中国区化学分析与材料和结构分析业务 Thermo Fisher / 赛默飞世尔科技. Author of 100+ granted/pending US patents. From 2000 until 2010 he additionally took over the position of personal assistant for the director of Fraunhofer IZM – Prof. Dr.-Ing. formally TWG of Assembly & Packaging of the International Roadmap of Semiconductors (ITRS) and now the Heterogeneous Integration Roadmap (HIR) and the Jisso International Council (JIC) where he is actively contributing to the strategy and packaging roadmap development. This presentation will discuss the trends and challenges of the FCBGA ecosystem and the three value creation roles OSAT’s play. In addition to his devotion in research activities, Steve is a promotor of technology commercialization. Semiconductor Principal Consultant, Omdia. 3 Feb 2021 - 4:12AM The key to GaN’s game-changing attack on silicon is true, monolithic integration – combining GaN FET, GaN logic and GaN analog circuits to achieve a ‘digital-in, power-out’ MHz building block. But a lot of these recruitments have been short-lived. 这些是您，客户，与中国国际半导体高管峰会（” CISES”）之间关于您使用我们的服务的合同的条件， 包括预订表中列出的活动出席人数。 该协议构成CISES与您之间的全部协议。 先前所有口头或书面协议的理解，谈判和陈述（欺诈性的虚假陈述除外）均完全取消，任何其他电子通信的条款均不构成本协议的一部分。, 我们将在活动前向您提供一份计划时间表。 请注意，我们可能会在必要的情况下更改该时间表。, 本公司保留在活动期间举行的研讨会和演讲的主题、范围和内容的决定权利，并在认为有需要时更改节目和/或其内容。, 如果活动因我们无法控制的原因或情况而取消或改变地点，我们保留重新安排活动的权利，包括更改地点和/或在书面通知您后撤回代表出席。 如果你的出席被我们取消，你将收到全额退费。, 只有指定或预先约定的代表才可出席活动。 任何代表不出席并不影响您根据以下条款（5）支付费用的义务。 除经正式登记或与本公司达成协议的人士外，其他人士不得出席活动的任何部分。, 代表们必须遵守营运经理指定的截止日期。 我们将在收到您的代表合同后通知您截止日期，这包括交回您的目录登记表、代表照片和您的优先会议请求选择。, 代表们需负责自己的保险（包括但不限于旅行保险，个人财物和个人保险），疫苗接种和签证（如适用）。, 该协议规定的总费用需支付7.5%的额外服务费（”服务费”），用于支付行政成本，并且不包括增值税和任何其他适用的销售税。, 如果您在活动前12周内取消报名，将产生1500英镑的费用（减去报名表上注明的任何报名费，您可能已经支付的费用将不予退还）。, 您可以通过提供贵公司的替代代表来避免取消造成的费用。您将承担因提供替代代表而产生的任何额外费用。我们保留拒绝替代代表的权利。, 所有的的取消报名必须以书面形式通知并经我们同意，并且必须在14天内支付全额取消费。, 未经我们事先同意,您,代表,执行人员或代理人不得全部或部分转让本协议的任何权利或义务。未经我们同意，任何转售，转让或转让权利的尝试都将使我们有权取消合同，而对您不承担任何责任。, 中国国际半导体高管峰会受《1998年英国数据保护法》的约束，并在英国的资讯专员处注册，以处理您的个人资料。我们搜集您的个人资料的主要目的是给您提供一个愉快的客制化体验，同时让我们提供最能满足您需求的服务和功能。我们会由这些信息是您在使用我们的网站和/或注册或订阅我们的产品和服务时所提供的提供资讯，来搜集您的个人讯息。如果您不希望我们继续使用这些资讯，请通知我们：enquiries@ioctr.com。任何提供给中国国际半导体高管峰会的个人信息作为注册过程的一部分和/或与中国国际半导体高管峰会的任何其他互动，将由中国国际半导体高管峰会、其子公司、相关公司或关联公司按照中国国际半导体高管峰会隐私政策搜集、储存和使用。请发送电子邮件至enquiries@ioctr.com获取中国国际半导体高管峰会隐私政策的副本。, 本协议受英国法律管辖，并根据英国法律进行解释，各方均不可撤销地同意，英格兰法院将具有非排他性管辖权来处理因本协议引起的，或与本协议有关的任何争议。, 這些是您，客戶，與中國國際半導體高管峰會（“ CISES”）之間關於您使用我們的服務的合同的條件， 包括預訂表中列出的活動出席人數。 該協議構成CISES與您之間的全部協議。 先前所有口頭或書面協議的理解，談判和陳述（欺詐性的虛假陳述除外）均完全取消，任何其他電子通信的條款均不構成本協議的一部分。, 我們將在活動前向您提供一份計劃時間表。請注意，我們可能會在必要的情況下更改該時間表。, 本公司保留在活動期間舉行的研討會和演講的主題、範圍和內容的決定權利，並在認為有需要時更改節目和/或其內容。, 如果活動因我們無法控制的原因或情況而取消或改變地點，我們保留重新安排活動的權利，包括更改地點和/或在書面通知您後撤回代表出席。如果你的出席被我們取消，你將收到全額退費。, 只有指定或預先約定的代表才可出席活動。任何代表不出席並不影響您根據以下條款(5)支付費用的義務。除經正式登記或與本公司達成協議的人士外，其他人士不得出席活動的任何部分。, 代表們必須遵守營運經理指定的截止日期。我們將在收到您的代表合同後通知您截止日期，這包括交回您的目錄登記表、代表照片和您的優先會議請求選擇。, 代表們需負責自己的保險（包括但不限於旅行保險，個人財物和個人保險），疫苗接種和簽證（如適用）。, 該協議規定的總費用需支付7.5%的額外服務費（”服務費”），用於支付行政成本，並且不包括增值稅和任何其他適用的銷售稅。, 如果您在活動前12週內取消報名，將產生1500英鎊的費用（減去報名表上註明的任何報名費，您可能已經支付的費用將不予退還）。, 您可以透過提供貴公司的替代代表來避免取消造成的費用。您將承擔因提供替代代表而產生的任何額外費用。 我們保留拒絕替代代表的權利。, 未經我們事先同意，您，代表，執行人員或代理人不得全部或部分轉讓本協議的任何權利或義務。 未經我們同意，任何轉售，轉讓或轉讓權利的嘗試都將使我們有權取消合同，而對您不承擔任何責任。, 中國國際半導體高管峰會受《 1998年英國數據保護法》的約束，並在英國的資訊專員處註冊，以處理您的個人資料。我們蒐集您的個人資料的主要目的是給您提供一個愉快的客制化體驗，同時讓我們提供最能滿足您需求的服務和功能。我們會由這些信息是您在使用我們的網站和/或註冊或訂閱我們的產品和服務時所提供資訊，來搜集您的個人訊息。如果您不希望我們繼續使用這些資訊，請通知我們：enquiries@ioctr.com。任何提供給中國國際半導體高管峰會的個人信息作為註冊過程的一部分和/或與中國國際半導體高管峰會的任何其他互動，將由世界太陽能大會、其子公司、相關公司或關聯公司按照中國國際半導體高管峰會隱私政策搜集、儲存和使用。請發送電子郵件至 enquiries@ioctr.com 獲取中國國際半導體高管峰會隱私政策的副本。, 本協議受英國法律管轄，並根據英國法律進行解釋，各方均不可撤銷地同意，英格蘭法院將具有非排他性管轄權來處理因本協議引起的，或與本協議有關的任何爭議。, B.S. As China emerges as leaders in advanced logic and memory fabrication and advanced chip design, the need for tools that accelerate yield learning and deliver great ROI in terms of Time-to-Market and automation become increasingly relevant. Since 2017, Dr. Li has been the Chairman of Simgui. However, the U.S.-China trade war that began in 2018 has stymied its efforts by denying the country access to advanced component technologies. Tim holds over two dozen issued United States patents relating to packaging, software, equipment, process, and design. CMOS sensor as the advanced sensing tip, is around us and improving our daily life anywhere and anytime. He is now Besi’s Chief Technology Officer and also responsible for strategic supply chain management and overall quality. Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region. He has authored and co-authored numerous scientific papers presentations and reports in the field of microelectronic packaging and holds a number of patents.
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